PolyDissolve™ S2

PolyDissolve™ S2 is a dissolvable support for PC, ABS and ASA based filaments from our portfolio. It is specifically engineered to have a perfect interface with these materials while also displaying good solubility

PolyDissolve™ is a family of dissolvable support filaments. This family offers support solution for our portfolio of filaments. It enables a greater design freedom.

Available Colors:

Natural

Diameter Size:

1.74 mm, 2.85 mm

Net Weight:

500 g

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Print Settings

Nozzle Temperature:

230˚C – 250˚C

Printing Speed:

30mm/s – 40mm/s

Bed Temperature

90˚C – 110˚C

Bed Surface:

Work on most surfaces designed for high temperature materials.

Cooling Fan:

OFF

Mechanical Properties

Young's Modulus:

Tensile Strength:

Elongation at Break:

Shore Hardness:

Bending Strength:

Charpy Impact:

Thermal Propertises

Glass Transition Temperature:

Vicat Softening Temperature:

Melting Temperature:

Notes

Drying Settings:

80˚C for 3h

Recommended Support Materials

30mm/s – 40mm/s

Other:

90˚C – 110˚C

Print Settings

Compatible Material:

Maximum Part Size (Diameter*Height):

Polishing Liquid:

Polishing Time:

Operating Temperature

Storage Temperature:

Power Supply (INPUT):

Power Supply (OUTPUT):

Polysher™ INPUT:

Desiccant Type:

Humidity Range:

Resolution

Response

Temperature Range:

Battery specifications

Operation Manual:

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